Job Description
WAND
Hardware (HW) Platform Application Engineer responsible for timely systems
level technical customer support, with a focus on the Hardware portion of the
customer's design (including schematic capture, PCB layout, power delivery,
signal integrity) , of a new generation of System-on-a-Chip (SoC) product
family is Intel's next generation of communication processors focused on the
wireless market, from product concept through volume production. The HW PAE
will interact, develop a strong working relationship with and support customer
HW Design Engineers, Power Delivery Designers, PCB Designers, Signal Integrity
Engineers, Program Management, Validation, Software and Firmware engineers
through the various customer design phases and will provide primary technical
support at the customer site during PO (Power-On) activities as well as
customer issue resolution through the life of the program. In addition, the HW
PAE must have develop a strong team oriented working relationship with local
Intel Software PAE supporting the same program as well as become the technical
liaison to the supporting Intel factory teams. The role requires a strong
analytical, logical and methodical approach to debug/root cause/resolve
customer reported issues during design and validation. The HW PAE will also be
responsible for fully understanding customer product requirements, roadmap
concerns (form factor, power, thermals, interfaces, peripherals) and use cases
and communicate the information to the factory teams as well as understand the
competitor's technical and support strengths and weaknesses. In addition, the
HW PAE will be responsible for giving product presentations to the customer as
well as training customer design teams.
Qualifications
-Should
have a BS or MS degree in the field of Electrical Engineering
-Minimum
of 8-10 years of relevant work experience in schematic capture, hardware
design, power delivery, PCB design, PCB layout as as well as power-on and debug
activities
-Must
have strong understanding of high speed Signal Integrity concepts and
simulation tools.
-Must
have extensive experience with test equipment: high speed oscilloscope (25 GHz
and greater), logic analyzer, protocol analyzer, multimeter, bench supplies,
etc.
-Must
have extensive experience in debugging embedded systems
-Must
have experience in the robust design and debug of high speed derail interfaces
(SERDES) as well as chip down DDR3/DDR4
-Embedded
systems programming experience
-TCL,
Python scripting experience
-Systems
level, logical and methodical approach to problem solving and low level
debugging
-Strong
communication skills and ability to work within a multicultural and global team
based in different worldwide locations
-Excellent
written communication skills, excellent documentation and presentation skills
is a must
-Acting
as a liaison between customer's requirements and chipset, platform and/or
software architecture teams to ensure `best-in-class' product definitions
-Ability
to understand and break down complex technical problems
-Ability
to work independently with minimal supervision with an interdisciplinary team
as well as ability to take the lead and drive the problem solving approach
-Some
travel may be required
