Senior Engineer for Package Technology Development 2009년 11월 27일에 설립된 다이오드, 트랜지스터 및 유사 반도체소자 제조업업종의 반도체,몰디드파워모듈 제조,도매,수출사업을 하는 중소기업, 외국 법인기업, 주식회사, 수출입 기업 입니다. |
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모집부문 및 상세내용| 모집부문 | 상세내용 |
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| 공통 자격요건 | ㆍ학력 : 대졸 이상 (4년)
ㆍ해외 여행 결격 사유가 없는 자
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| Unit Process Development 2명 | 1. Wire Bonding 공정
담당업무
- • Deliver stable unit process development under the package development project in accordance to project timeline, yield and cost targets
• Continuous exploring on breakthrough in new unit process development and new test method or characterization development for semiconductor packaging
in consideration with product, package, process or customer specific requirements
• Coordinate across internally (business divisions, segments order departments) and externally (equipment/material suppliers) to generate or update technical documentations (Chip Specification, Process Specification, Control Plan, FMEA, Failure Catalog, Procurement Specification and equipment release), requirement for equipment or material to develop stable unit process for manufacturing
• Technical lead / coach for specific Au / Cu wire bonding or Alu Wedge wire bonding process development
• Identify problem or deviation and recommend & implement corrective actions
• Derive and define new process design guideline for new package / product technologies
• Support End-to-End needs on tolling and machine ramp-up requirement
• Conduct process knowledge transfer to sustaining team
지원자격 | - • Work experience in years: Minimum 3 years of working experience in semiconductor industry.
(Process Development, Process engineering, Manufacturing engineering in Assembly)
• Technical / functional experience in years: Minimum 3 years of solid experience in Wire Bonding (Au & Alu wire bonding) or FOL process
(Equipment system & process know-how)
• Equipment hands-on, understand equipment mechanism, function & troubleshooting
• Intermediate level of written/spoken English
• Bachelor’s Degree or Master’s Degree in Electrical, Electronic, Mechanical, Material engineering or equivalent
• Statistical data analysis skills and problem solving skills (Minitab or JMP)
• In depth knowledge of Design of Experiment
• Auto CAD skill for tool & part design
• MS excel & PPT for strive for excellence
• Positive attitude towards work ad team activities
• Collaborate with other departments for successful new product development
2. Mold 공정
담당업무
- • Deliver stable unit process development under the package development project in accordance to project timeline, yield and cost targets
• Continuous exploring on breakthrough in new unit process development and new test method or characterization development for semiconductor packaging
in consideration with product, package, process or customer specific requirements
• Coordinate across internally (business divisions, segments order departments) and externally (equipment/material suppliers) to generate or update technical documentations
(Chip Specification, Process Specification, Control Plan, FMEA, Failure Catalog, Procurement Specification and equipment release),
requirement for equipment or material to develop stable unit process for manufacturing
• Technical lead / coach for specific Mold process development
• Identify problem or deviation and recommend & implement corrective actions
• Derive and define new process design guideline for new package / product technologies
• Support End-to-End needs on tolling and machine ramp-up requirement
• Conduct process knowledge transfer to sustaining team
지원자격 | - • Work experience in years: Minimum 3 years of working experience in semiconductor industry.
(Process Development, Process engineering, Manufacturing engineering in Assembly)
• Technical / functional experience in years: Minimum 3 years of solid experience in Mold or EOL process
(Equipment system & process know-how)
• Equipment hands-on, understand equipment mechanism, function & troubleshooting
• Intermediate level of written/spoken English
• Bachelor’s Degree or Master’s Degree in Electrical, Electronic, Mechanical, Material engineering or equivalent
• Statistical data analysis skills and problem solving skills (Minitab or JMP)
• In depth knowledge of Design of Experiment
• Auto CAD skill for tool & part design
• MS excel & PPT for strive for excellence
• Positive attitude towards work ad team activities
• Collaborate with other departments for successful new product development
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| 근무조건| ㆍ근무형태:정규직(수습기간)-3개월 | | ㆍ근무일시:주 5일(월~금) 08:30~17:30 | | ㆍ근무지역:(31226) 충남 천안시 동남구 목천읍 삼성4길 56 |
| 전형절차
| 접수기간 및 방법| ㆍ접수기간:2024년 5월 8일 (수) 10시 ~ 2024년 6월 7일 (금) 24시 | | ㆍ접수방법:홈페이지 지원 | | ㆍ이력서양식:자유양식 | | ㆍ제출서류: |
| 유의사항| ㆍ학력, 성별, 연령을 보지않는 블라인드 채용입니다. | | ㆍ입사지원 서류에 허위사실이 발견될 경우, 채용확정 이후라도 채용이 취소될 수 있습니다. | | ㆍ모집분야별로 마감일이 상이할 수 있으니 유의하시길 바랍니다. |
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