외국계 반도체 장비 회사 - 공정 엔니지어 채용

MAJOR RESPONSIBILITIES

Process set-up and support for wafer bonding, lithography and inspection products installed at Semiconduction fab / R&D institutes
Sales support for new business


SPECIFIC DUTIES

1. Delivers on-site process services such as :
• Acceptance test during installation
• Problem resolutions
• Conducting customer training

2. Technical collaboration with HQ process team to demonstrate process

3. Technical presentation for process and products to customers

4. Attend exhibition and conference in the area of semiconductor, MEMS and nanotechnology

5. Be an effective member of the process team through :
• Submitting weekly report.
• Proactive communication with the account team/management about customer activities. Updating and communication of process support plans and requirements.
• Creating/maintaining account file and updating customer information timely.
• Getting feedback on customer satisfaction and acting on concerns by frequent contacts with assigned customers.

6. Improves personal expertise and effectiveness by :
• Becoming familiar with EV Group Process and Alert/Escalation System
• Attending necessary training to increase competency in assigned technology and to increase productivity and professionalism.
• Practicing teamwork within country, region and across disciplines.

7. Attends all process meetings as assigned.

8. Undertakes any other duties as may be assigned by Process Manager and/or General Manager.


EDUCATION, EXPERIENCE & SKILLS REQUIRED

 Bachelor or master Degree in Engineering

 At least 2 years’ fab process experience preferred but not limited

 Process knowledge in wafer bonding and lithography preferred but not limited

 Ability and Willingness to travel frequently out of home base.

 Computer literacy is a must.

 A positive team player.

 Good spoken and written communication skills in English.

 Those with fab/semi vendor experiences would be preferred.